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Boolean: (bicycle AND helmet) OR (head AND protection) (always group AND in parenthesis)
Title: title:(climate change)
Author: author:("bohr niels" OR "bohr n") (avoid only full first name)
Phrase: "water pump control" (does not work with wildcards)
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Book chapter

Fluxless flip-clip bonding for the photonic assembly: comparison between evaporated SnPb (60/40) and AuSn (80/20) solder

In Micro System Technologies 96: 5th Int. Conf. on Micro Electro, Opto, Mechanical Systems and Components — 1996, pp. 91-97

By Kuhmann, Jochen Friedrich1; Harde, P.; Pech, D.; Pittroff, W.; Preuss, A.; Wirth, T.; Österle, W.

Edited by Heuberger, A.; Reichl, H.

From

Department of Micro- and Nanotechnology, Technical University of Denmark1

Language: English
Year: 1996
Pages: 91-97
Types: Book chapter

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Analysis