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Book chapter

Flip Chip Mounting of Laser Diodes with AuSn Solder Bumps; Bumping, Self-Alignment & Laser Behavior

In 47th Ectc — 1997, pp. 1235-1241
From

Department of Micro- and Nanotechnology, Technical University of Denmark1

Language: English
Year: 1997
Pages: 1235-1241
Proceedings: 47th Electronic Components and Technology Conference
Types: Book chapter

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Analysis