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Conference paper

Application of modelling tools for precise transfer of nanostructures from silicon wafers to steel injection moulding tool inserts

In Proceedings of the 18th International Conference of the European Society for Precision Engineering and Nanotechnology — 2018, pp. 59-60
From

Department of Mechanical Engineering, Technical University of Denmark1

Manufacturing Engineering, Department of Mechanical Engineering, Technical University of Denmark2

Functional nanostructures applied on various consumer products has attracted increasing attention in the industry. Examples of functional nanostructures are well known from nature, where organisms and plants possess optical, adhesive, and self-cleaning capabilities. The aim of the present work is to produce injection moulding tool inserts with the nanostructured functional surfaces as mentioned above.

In order to manufacture these structures on the double-curved surfaces of the injection moulding tool inserts, a technology called nanoimprint lithography (NIL) with flexible stamps is applied. However, the resolution limit due to distortion of the stamp when applying the pressure, and complications regarding deformations of the flexible stamp, is a major concern for precise replication of the nanostructures whose functionality might change dramatically with just a few nanometres of distortion.

Here, the application of modelling tools is essential in order to predict how the flexible stamp will deform during the transferring process. However, such models are quit complicated since the overall behaviour is non-linear. A review of different manufacturing and simulation cases will be presented and gives an overview of today’s methodologies for transfer of nanostructures to curved surfaces.

Language: English
Publisher: The European Society for Precision Engineering and Nanotechnology
Year: 2018
Pages: 59-60
Proceedings: 18th International Conference of the european Society for Precision Engineering and Nanotechnology (euspen 18)
Types: Conference paper
ORCIDs: Sonne, M. R. and Hattel, J. H.

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