Conference paper
Simulation of electronic circuit sensitivity towards humidity using electrochemical data on water layer
Climatic conditions like temperature and humidity have direct influence on the operation of electronic circuits. The effects of temperature on the operation of electronic circuits have been widely investigated, while the effect of humidity and solder flux residues are not well understood including the effect on circuit and PCBA (printed circuit board assembly) layout design.
This paper elucidates a methodology for analyzing the sensitivity of an electronic circuit based on parasitic circuit analysis using data on electrical property of the water layer formed under humid as well as contaminated conditions. Some commonly used circuits are analyzed as case studies and flux related contaminations of PCBA from process is used as an example to show how different flux chemistry and humidity together compromise the circuit functionality.
Language: | English |
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Publisher: | IEEE |
Year: | 2015 |
Pages: | 1-5 |
Proceedings: | 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) |
ISBN: | 1467372684 , 1467372692 , 1467372706 , 9781467372688 , 9781467372695 and 9781467372701 |
Types: | Conference paper |
DOI: | 10.1109/EPTC.2015.7412281 |
Electronic circuits Humidity Regulators Resistance Resistors Soldering Water pollution circuit functionality electrochemical data electronic circuit sensitivity humidity integrated circuit packaging network analysis parasitic circuit analysis printed circuit board assembly printed circuits water layer