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10 items by relevance
1 Conference paper

Corrosion Reliability of Lead-free Solder Systems Used in Electronics

Li, Feng; Verdingovas, Vadimas; Medgyes, Balint; Ambat, Rajan

Proceedings of the European Corrosion Congress (eurocorr 2017) — 2017, pp. 1-6

The present work investigated the corrosion reliability of Sn-Ag-Cu based five lead-free solder alloys. The corrosion and electrochemical migration (ECM) susceptibility study of the solder alloys has been carried out by water droplet (WD) tests on pure alloy ingot samples, and by accelerated

Year: 2017

Language: English

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2 Conference paper

Corrosion Reliability of Lead-Free Solder Systems Used in Electronics

Li, Feng; Verdingovas, Vadimas; Dirscherl, Kai; Medgyes, Balint; Ambat, Rajan

Proceedings 2018 Imaps Nordic Conference on Microelectronics Packaging (nordpac 2018) — 2018, pp. 67-71

The present work investigated the corrosion reliability of five Sn-Ag-Cu (SAC) based lead-free solder alloys. The first focus was placed on microstructural analysis of the intermetallic compounds (IMCs) formation in the ingots of SAC alloys and their influence on micro galvanic corrosion

Year: 2018

Language: English

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jaledgnbp icf hkom

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