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Conference paper

A 175 GHz Bandwidth High Linearity Distributed Amplifier in 500 nm InP DHBT Technology

From

Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik1

Electromagnetic Systems, Department of Electrical Engineering, Technical University of Denmark2

Department of Electrical Engineering, Technical University of Denmark3

This work reports a highly linear and efficient ultra-wideband distributed amplifier in 500 nm transferred-substrate InP DHBT technology. Five unit cells each with a tri-code transistor set provide the ultra-wideband properties of this amplifier. A transistor node of 500 nm is used which has an ft and fmax of 350 and 490 GHz respectively.

The measurements show a small-signal gain of 12 dB with a 3-dB bandwidth of near-DC to 175 GHz. For large signal operation, the circuit reaches a 1-dB output compression point, P1dB, of 8.4 dBm at 150 GHz, a saturated output power of approximately 10 dBm, and an associated maximum PAE of 6 %. This is the best linearity as well as the highest saturated output power and PAE reported at this frequency for DAs.

The circuit consumes 180 mW DC power only.

Language: English
Publisher: IEEE
Year: 2019
Pages: 1253-1256
Proceedings: 2019 IEEE MTT-S International Microwave Symposium
ISBN: 1728113091 , 1728113105 , 9781728113098 and 9781728113104
ISSN: 0149645x and 25767216
Types: Conference paper
DOI: 10.1109/MWSYM.2019.8700895
ORCIDs: Johansen, Tom

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