Conference paper
Wafer Level Characterization of Row-Column Addressed CMUT Arrays
Department of Health Technology, Technical University of Denmark1
Biomedical Engineering, Department of Health Technology, Technical University of Denmark2
Mems Applied Sensors Group, Biomedical Engineering, Department of Health Technology, Technical University of Denmark3
Technical University of Denmark4
Center for Fast Ultrasound Imaging, Biomedical Engineering, Department of Health Technology, Technical University of Denmark5
Nano and Bio-physical Systems, Department of Health Technology, Technical University of Denmark6
Optofluidics, Nano and Bio-physical Systems, Department of Health Technology, Technical University of Denmark7
This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device.
This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.
Language: | English |
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Publisher: | IEEE |
Year: | 2019 |
Pages: | 770-773 |
Proceedings: | 2019 IEEE International Ultrasonics Symposium |
ISBN: | 1728145953 , 1728145961 , 172814597X , 172814597x , 9781728145952 , 9781728145969 and 9781728145976 |
ISSN: | 19485719 and 19485727 |
Types: | Conference paper |
DOI: | 10.1109/ultsym.2019.8926136 |
ORCIDs: | Thomsen, Erik Vilain , Ommen, Martin Lind , Grass, Rune Sixten and Engholm, Mathias |