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Conference paper

Wafer Level Characterization of Row-Column Addressed CMUT Arrays

From

Department of Health Technology, Technical University of Denmark1

Biomedical Engineering, Department of Health Technology, Technical University of Denmark2

Mems Applied Sensors Group, Biomedical Engineering, Department of Health Technology, Technical University of Denmark3

Technical University of Denmark4

Center for Fast Ultrasound Imaging, Biomedical Engineering, Department of Health Technology, Technical University of Denmark5

Nano and Bio-physical Systems, Department of Health Technology, Technical University of Denmark6

Optofluidics, Nano and Bio-physical Systems, Department of Health Technology, Technical University of Denmark7

This paper presents a measurement methodology for wafer level characterization of row-column addressed (RCA) capacitative micromachined ultrasound transducers (CMUT). Characterization of a 62+62 element RCA CMUT is presented. To facilitate wafer level electrical characterization measurements between adjacent electrodes can be used to characterize the device.

This allows for determination of the individual element capacitance. Current-voltage measurements between adjacent top or bottom electrodes provides valuable information about process yield.

Language: English
Publisher: IEEE
Year: 2019
Pages: 770-773
Proceedings: 2019 IEEE International Ultrasonics Symposium
ISBN: 1728145953 , 1728145961 , 172814597X , 172814597x , 9781728145952 , 9781728145969 and 9781728145976
ISSN: 19485719 and 19485727
Types: Conference paper
DOI: 10.1109/ultsym.2019.8926136
ORCIDs: Thomsen, Erik Vilain , Ommen, Martin Lind , Grass, Rune Sixten and Engholm, Mathias

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