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Conference paper

Critical level of water film formation under transient condensing condition leading to PCBA failures

By Conseil-Gudla, Helene1,2; Ambat, Rajan1,2,3

From

Materials and Surface Engineering, Department of Mechanical Engineering, Technical University of Denmark1

Department of Mechanical Engineering, Technical University of Denmark2

Centre for oil and gas – DTU, Technical University of Denmark3

Language: English
Year: 2021
Proceedings: EUROCORR 2021
Types: Conference paper
ORCIDs: Ambat, Rajan
Keywords

Condensation Conductivity Contamination Humidity Impedance Leak current Reliability Thickness Water film

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