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Conference paper · Journal article

Estimation of Water Diffusion Coefficient into Polycarbonate at Different Temperatures Using Numerical Simulation

By Shojaee Nasirabadi, Parizad1; Jabbaribehnam, Mirmasoud1,2; Hattel, Jesper Henri1,2

Edited by Simos, Theodore; Tsitouras, Charalambos

From

Department of Mechanical Engineering, Technical University of Denmark1

Manufacturing Engineering, Department of Mechanical Engineering, Technical University of Denmark2

Nowadays, many electronic systems are exposed to harsh conditions of relative humidity and temperature. Masstransport properties of electronic packaging materials are needed in order to investigate the influence of moisture andtemperature on reliability of electronic devices. Polycarbonate (PC) is widely used in the electronics industry.

Thus, in this work the water diffusion coefficient into PC is investigated. Furthermore, numerical methods used for estimation of the diffusion coefficient and their assumptions are discussed. 1D and 3D numerical solutions are compared and based on this, itis shown how the estimated value can be different depending on the choice of dimensionality in the model.

Language: English
Publisher: AIP Publishing LLC
Year: 2016
Proceedings: 13th International Conference of Numerical Analysis and Applied Mathematics 2015 (ICNAAM 2015)
ISSN: 15517616 and 0094243x
Types: Conference paper and Journal article
DOI: 10.1063/1.4951801
ORCIDs: Shojaee Nasirabadi, Parizad , Jabbaribehnam, Mirmasoud and Hattel, Jesper Henri
Keywords

CFD Diffusion Enclosure Moisture

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