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Conference paper

High output power ultra-wideband distributed amplifier in InP DHBT technology using diamond heat spreader

From

Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik1

Department of Electrical Engineering, Technical University of Denmark2

Electromagnetic Systems, Department of Electrical Engineering, Technical University of Denmark3

This work reports on a highly linear and high output power ultra-wideband distributed amplifier with improved thermal properties using a diamond layer for heat spreading. The performances of a circuit with and without the diamond heat spreader are compared. Adding the diamond yields a 4 dB improvement in 1 dB compression point (P1dB) and saturated output power (Psat).

Intermodulation distortion has also been measured and the amplifier achieves 24 dBm OIP3 over a bandwidth larger than 60 GHz. In terms of small-signal characteristics, the circuit shows 12 dB gain and low deviation from linear phase, similarly to the non-diamond version. This amplifier demonstrates highest P1dB, OIP3, and PAE values as compared to other technologies with similar or higher bandwidth.

Language: English
Publisher: IEEE
Year: 2020
Pages: 401-404
Proceedings: 2020 IEEE/MTT-S International Microwave Symposium
Series: I E E E - M T T S International Microwave Symposium. Digest
ISBN: 1728168155 , 1728168163 , 9781728168159 and 9781728168166
ISSN: 0149645x and 25767216
Types: Conference paper
DOI: 10.1109/IMS30576.2020.9223893
ORCIDs: Johansen, Tom Keinicke

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