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Boolean: (bicycle AND helmet) OR (head AND protection) (always group AND in parenthesis)
Title: title:(climate change)
Author: author:("bohr niels" OR "bohr n") (avoid only full first name)
Phrase: "water pump control" (does not work with wildcards)
Wildcards: wom?n pharm*

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Conference paper

Solder mask surface properties and related PCBA failure due to build-up of water layer

By Lakkaraju, Anish Rao1,2; Conseil-Gudla, Helene1,2; Steiner, Frantisek3; Ambat, Rajan1,2,4

From

Materials and Surface Engineering, Department of Mechanical Engineering, Technical University of Denmark1

Department of Mechanical Engineering, Technical University of Denmark2

University of West Bohemia3

Centre for oil and gas – DTU, Technical University of Denmark4

Language: English
Year: 2021
Proceedings: EUROCORR 2021
Types: Conference paper
ORCIDs: Ambat, Rajan
Keywords

Humidity Impedance Printed circuit board laminate Solder mask Surface roughness Temperature Water layer formation

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