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Conference paper

Applicability of Acoustic Emission monitoring to micro polishing

In Proceedings of the 18th International Conference of the European Society for Precision Engineering and Nanotechnology — 2018, pp. 385-386
From

Manufacturing Engineering, Department of Mechanical Engineering, Technical University of Denmark1

Department of Mechanical Engineering, Technical University of Denmark2

Application of process monitoring solutions to micro polishing is affected by the low intensity of the measured signals, which influences the capability to extract useful information. This work explores the applicability of acoustic emission monitoring for detection of process completion through End Point Detection (EPD) in micro polishing.

Several polishing tests have been conducted by gradually reducing the contact area and the acoustic emission signal generated by the process is acquired and analysed. The work shows that the monitoring solutions applied in conventional polishing can potentially be applied to the micro process.

Language: English
Publisher: The European Society for Precision Engineering and Nanotechnology
Year: 2018
Pages: 385-386
Proceedings: 18th International Conference of the european Society for Precision Engineering and Nanotechnology (euspen 18)
Types: Conference paper
ORCIDs: De Chiffre, L.

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