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title:(Two AND component AND micro AND injection AND moulding AND for AND moulded AND interconnect AND devices)

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1 PhD Thesis

Two component micro injection moulding for moulded interconnect devices

Moulded interconnect devices (MIDs) contain huge possibilities for many applications in micro electro-mechanical-systems because of their capability of reducing the number of components, process steps and finally in miniaturization of the product. Among the available MID process chains, two

Year: 2008

Language: English

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2 Other

Two component micro injection moulding for moulded interconnect devices: 2k moulding for MIDs

Among the available MID process chains, two component (2k) injection moulding with subsequent selective metallization is one of the most industrially adaptive processes. However the use of two component injection moulding for MID fabrication, with circuit patterns in the sub-millimeter range

Year: 2008

Language: English

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