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Journal article

Double layer resist process scheme for metal lift-off with application in inductive heating of microstructures

By Ouattara, Lassana1,2,3; Knutzen, Michael3; Keller, Stephan Urs1,2,3; Hansen, M. F.; Boisen, Anja1,2,3

From

Nanoprobes Group, NanoSystemsEngineering Section, Department of Micro- and Nanotechnology, Technical University of Denmark1

NanoSystemsEngineering Section, Department of Micro- and Nanotechnology, Technical University of Denmark2

Department of Micro- and Nanotechnology, Technical University of Denmark3

We present a new method to define metal electrodes on top of high-aspect-ratio microstructures using standard photolithography equipment and a single chromium mask. A lift-off resist (LOR) layer is implemented in an SU-8 photolithography process to selectively remove metal at the end of the processing.

In this way, we have successfully defined metal electrodes on top of 75 mu m high SU-8 microstructures to be used as test structures for the measurement of temperature increase due to inductive heating.

Language: English
Year: 2010
Pages: 1226-1228
ISSN: 18735568 and 01679317
Types: Journal article
DOI: 10.1016/j.mee.2009.11.147
ORCIDs: Keller, Stephan Urs and Boisen, Anja
Keywords

Double layer LOR/positive photoresist lift-off Metallization of high-aspect-ratio structures SU-8 microfabrication

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