Journal article
Bubble formation at grain boundaries in helium implanted copper
Copper implanted with helium at elevated temperatures has been examined by TEM. Helium bubbles with sizes larger than the size of bubbles in the interior of the grains had precipitated at some of the boundaries. The size of the bubbles in the boundaries tended to increase with increasing boundary energy.
Language: | English |
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Year: | 2004 |
Pages: | 557-560 |
ISSN: | 18728456 and 13596462 |
Types: | Journal article |
DOI: | 10.1016/j.scriptamat.2004.05.038 |