Conference paper
PCB Embedded Inductor for High-Frequency ZVS SEPIC Converter
The volume and temperature rise of passive components, especially inductors, limit the momentum toward high power density in high-frequency power converters. To address the limitations, PCB integration of passive components should be considered with the benefit of low profile, excellent thermal characteristic and cost reduction.
This paper investigates an embedded structure of inductors to further increase the power density of a low power DC-DC converter. A pair of coupling inductors have been embedded into the PCB. The detailed embedded process has been described and the characteristics of embedded inductor and design consideration are discussed.
A 2MHz SEPIC converter working in ZVS turn-on with embedded inductors is built to verify the effectiveness of the embedded structure.
| Language: | English |
|---|---|
| Publisher: | IEEE |
| Year: | 2018 |
| Pages: | 98-104 |
| Proceedings: | 2018 IEEE Applied Power Electronics Conference and Exposition |
| ISBN: | 1538611791 , 1538611805 , 1538611813 , 9781538611791 , 9781538611807 and 9781538611814 |
| ISSN: | 10482334 and 24706647 |
| Types: | Conference paper |
| DOI: | 10.1109/APEC.2018.8340994 |
| ORCIDs: | Dou, Yi , Ouyang, Ziwei , Thummala, Prasanth and Andersen, Michael A. E. |
DC-DC power convertors GaN HEMT Inductors Magnetic devices Magnetic materials PCB embedded inductor PCB integration Permeability SEPIC converter Windings Zero voltage switching cost reduction coupling inductors detailed embedded process embedded inductors embedded structure excellent thermal characteristic frequency 2.0 MHz high power density high-frequency ZVS SEPIC converter high-frequency power converters inductors low power DC-DC converter low profile multi-MHz passive components planar magnetics power density printed circuits switching convertors temperature rise zero voltage switching
