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Conference paper

Hot embossing of high aspect ratio sub-μm structured surfaces for micro fluidic applications

In 4. International Conference on Multi-material Micro Manufacture — 2008, pp. 209-212

By Heckele, Mathias1; Worgull, Matthias1; Mappes, Timo1; Tosello, Guido2,3; Metz, Tobias4; Gavillet, Jerome5; Koltay, Peter4; Hansen, Hans Nørgaard2,3

From

Forschungs Zentrum Karlsruhe GmbH1

Manufacturing Engineering, Department of Mechanical Engineering, Technical University of Denmark2

Department of Mechanical Engineering, Technical University of Denmark3

University of Freiburg4

Conseil Energie Atomique5

Language: English
Publisher: Whittles Publishing
Year: 2008
Pages: 209-212
Proceedings: 4th International Conference on Multi-Material Micro Manufacture
Journal subtitle: (4m2008)
ISBN: 1849954135 , 1904445764 , 9781849954136 and 9781904445760
Types: Conference paper
ORCIDs: Tosello, Guido and Hansen, Hans Nørgaard

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