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Conference paper

Demonstration of Chip-To-Chip Quantum Teleportation

In Proceedings of 2019 Conference on Lasers and Electro-optics — 2019, pp. 1-2

By DIng, Y.1,3,4,5; Llewellyn, D.6; Faruque, I.6; Paesani, S.6; Bacco, D.1,4,5; Santagati, R.6; Qian, Y.7; Li, Y.7; Xiao, Y.7; Huber, M.8; Malik, M.9; Sinclair, G.6; Zhou, X.10; Rottwitt, K.1,2,5; O'Brien, J.6; Rarity, J.6; Gong, Q.7; Oxenlowe, L.1,4,5; Wang, J.7; Thompson, M.6 ...and 10 more

From

Centre of Excellence for Silicon Photonics for Optical Communications, Centers, Technical University of Denmark1

Fiber Optics, Devices and Non-linear Effects, Department of Photonics Engineering, Technical University of Denmark2

Nanophotonic Devices, Department of Photonics Engineering, Technical University of Denmark3

Ultra-fast Optical Communication, Department of Photonics Engineering, Technical University of Denmark4

Department of Photonics Engineering, Technical University of Denmark5

University of Bristol6

Peking University7

Austrian Academy of Sciences8

Heriot-Watt University9

Sun Yat-Sen University10

...and 0 more

We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.

Language: English
Publisher: IEEE
Year: 2019
Pages: 1-2
Proceedings: 2019 CLEO Conference & Exhibition
Series: 2019 Conference on Lasers and Electro-optics, Cleo 2019 - Proceedings
ISBN: 1728137187 , 194358057X , 194358057x , 9781728137186 and 9781943580576
Types: Conference paper
DOI: 10.23919/CLEO.2019.8750050
ORCIDs: DIng, Y. , Bacco, D. , Rottwitt, K. and Oxenlowe, L.

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