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Conference paper

In-situ Investigation of Lead-free Solder Alloy Formation Using a Hot-plate Microscope

In Proceedings of the 9th Ieee Electronics Packaging Technology Conference — 2007, pp. 252-256
From

Department of Management Engineering, Technical University of Denmark1

Institute for Product Development, Technical University of Denmark2

This work presents the advantages of using a hot-plate microscope for investigation of new (high-temperature) lead- free solders as in-situ analysis tool and preparation equipment. A description of the equipment and the preparation method is given and some examples are outlined. The formation of small AuSn-based, homogeneous and un-oxidized solder spheres will be demonstrated.

Moreover the possibility of using this equipment as a sample preparation method to further investigation is shown. As example the equipment was used to produce samples for Vickers microhardness measurement of important phases of the Au-Sn system. The measured values are comparable to those found in the literature.

An outlook to further research is also given.

Language: English
Publisher: IEEE
Year: 2007
Pages: 252-256
Proceedings: 2007 9th Electronics Packaging Technology Conference
ISBN: 1424413230 , 1424413249 , 9781424413232 , 9781424413249 , 1509090142 and 9781509090143
Types: Conference paper
DOI: 10.1109/EPTC.2007.4469822
ORCIDs: Hansen, Hans Nørgaard

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