Conference paper
Electrostatic energy harvesting device with out-of-the-plane gap closing scheme
In this paper, we report on an electrostatic energy harvester with an out-of-the-plane gap closing scheme. Using advanced MEMS technology, energy harvesting devices with a four wafer stack are batch fabricated and fully packaged at wafer scale. CYTOP polymer is used both as an electret material and an adhesive layer for low temperature wafer bonding.
The overall size of the device is about 1.1×1.3 cm2. With an external load of 13.4 MΩ, a power output of 0.15 μW is achieved when vibration at an acceleration amplitude of 1 g (9.8 m/s2) is applied at a low frequency of 96 Hz. The frequency response of the device is also measured and a broader bandwidth is observed at higher acceleration amplitude. © 2013 IEEE.
| Language: | English |
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| Publisher: | IEEE |
| Year: | 2013 |
| Pages: | 2237-2240 |
| Proceedings: | 17th International Conference on Solid-State Sensors, Actuators and Microsystems |
| Journal subtitle: | 17th International Conference on Solid-state Sensors, Actuators and Microsystems |
| ISBN: | 1467359823 , 1467359831 , 9781467359825 and 9781467359832 |
| ISSN: | 21641641 and 2159547x |
| Types: | Conference paper |
| DOI: | 10.1109/Transducers.2013.6627249 |
| ORCIDs: | Hansen, Ole |
Acceleration CYTOP polymer Electrodes Etching Frequency measurement Vibrations adhesive layer advanced MEMS technology electret material electrets electrostatic devices electrostatic energy harvesting device energy harvesting frequency 96 Hz frequency measurement frequency response measurement low temperature wafer bonding microfabrication micromechanical devices out-of-the-plane gap closing scheme polymers power 0.15 muW resistance 13.4 Mohm wafer bonding wafer level packaging wafer scale packaging wafer stack wafer-scale integration
