Journal article
In situ observation of triple junction motion during recovery of heavily deformed aluminum
Microstructural evolution during in situ annealing of heavily cold-rolled aluminum has been studied by transmission electron microscopy, confirming that an important recovery mechanism is migration of triple junctions formed by three lamellar boundaries (Y-junctions). The migrating Y-junctions are pinned by deformation-induced interconnecting and lamellar boundaries, which slow down the recovery process and lead to a stop-go migration pattern.
This pinning mechanism stabilizes the deformation microstructure, i.e. the structure is stabilized by balancing the driving and pinning forces controlling the rate of triple junction motion. As a consequence, recovery and the subsequent recrystallization are strongly retarded. The mechanisms underlying Y-junction motion and its pinning are analyzed and discussed.
Language: | English |
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Year: | 2015 |
Pages: | 269-278 |
ISSN: | 18732453 and 13596454 |
Types: | Journal article |
DOI: | 10.1016/j.actamat.2014.12.014 |
ORCIDs: | Yu, Tianbo and Huang, Xiaoxu |
Aluminum Annealing Cold rolling Cold-rolled aluminum Deformation Deformation microstructure Deformation structure Electron microscopy In-situ observations Lamellar boundaries Metal cladding Migration patterns Recovery Recovery mechanisms Transmission electron microscopy Transmission electron microscopy (TEM) Triple junction