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Conference paper

Integrated packaging concept for an intelligent transducer

In Integrated Packaging Concept for an Intelligent Transducer — 1999, pp. 344-52
From

Department of Micro- and Nanotechnology, Technical University of Denmark1

Language: English
Publisher: SPIE
Year: 1999
Pages: 344-52
Proceedings: Symposium on Smart Electronics and MEMS. Proceedings of the SPIE - The International Society for Optical
Types: Conference paper

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