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Boolean: (bicycle AND helmet) OR (head AND protection) (always group AND in parenthesis)
Title: title:(climate change)
Author: author:("bohr niels" OR "bohr n") (avoid only full first name)
Phrase: "water pump control" (does not work with wildcards)
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title:(Deep AND Reactive AND Ion AND Etching AND for AND High AND Aspect AND Ratio AND Microelectromechanical AND Components)

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10 items by relevance
1 Conference paper

Deep Reactive Ion Etching for High Aspect Ratio Microelectromechanical Components

Jensen, Søren; Yalcinkaya, Arda Deniz; Jacobsen, S.; Rasmussen, T.; Rasmussen, Frank Engel; Hansen, Ole

Nordic Semiconductor Meeting Paper 1040 — 2003

Year: 2003

Language: English

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2 Journal article

Deep Reactive Ion Etching for High Aspect Ratio Microelectromechanical Components

Jensen, Søren; Yalcinkaya, Arda Deniz; Jacobsen, S.; Rasmussen, T.; Rasmussen, Frank Engel; Hansen, Ole

Physica Scripta. Topical Issues — 2004, Volume T114, pp. 188-192

A deep reactive ion etch (DRIE) process for fabrication of high aspect ratio trenches has been developed. Trenches with aspect ratios exceeding 20 and vertical sidewalls with low roughness have been demonstrated. The process has successfully been used in the fabrication of silicon-on-insulator (SOI

Year: 2004

Language: English

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