Conference paper
Improving intrinsic corrosion reliability of printed circuit board assembly
Corrosion reliability is a serious issue today for electronic devices, components, and bare printed circuit boards (PCBs) due to factors such as miniaturization, globalized manufacturing practices, and global usage. Electronic components and devices are exposed to a wide variety of climatic conditions, therefore the protection of electronic devices is becoming a critical factor in system design.
Humidity and local condensation inside electronic enclosures can significantly alter the performance of electronic devices. The presence of moisture in a PCB alters its quality, functionality, thermal performance, and thermo-mechanical properties, while condensation on the surface of printed circuit board assemblies (PCBAs) can lead to electrical failures, like electrochemical migration.
The result is reduced life span for electronic products and heavy economic loss due to failures.
| Language: | English |
|---|---|
| Publisher: | IEEE |
| Year: | 2016 |
| Pages: | 540-544 |
| Proceedings: | 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) |
| ISBN: | 1509043683 , 1509043691 , 1509043705 , 9781509043682 , 9781509043699 and 9781509043705 |
| Types: | Conference paper |
| DOI: | 10.1109/EPTC.2016.7861538 |
Corrosion Humidity Moisture Ocean temperature Reliability Surface treatment Temperature bare printed circuit boards climatic conditions condensation corrosion electronic components electronic devices electronic enclosures functionality properties humidity integrated circuit reliability intrinsic corrosion reliability local condensation printed circuit board assembly printed circuits quality properties thermal performance thermo-mechanical properties
