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Journal article

Improvement of the dose uniformity in plasma immersed ion implantation by introducing a vertical biased ring

From

Nagoya University, Department of Electrical Engineering and Computer Science, Furo-cho, Chikusa-ku, Nagoya 464-8603, Japan

It is shown that the sheath evolving to a negatively biased wafer during the plasma immersed ion implantation focuses the positive ions to distinct regions on the surface resulting in a poor uniformity of the ion dose. The focusing mechanism is investigated and solutions to improve the ion dose uniformity are proposed based on three-dimensional calculations of the potential distribution and ion trajectories within the sheath structure.

Simulations are confirmed at lower scale in a DC Ar plasma which allows an easier visualization of the focusing phenomenon simultaneously with the measurement of the involved currents.

Language: English
Year: 2005
Pages: 571-574
ISSN: 18792731 and 00406090
Types: Journal article
DOI: 10.1016/j.tsf.2005.08.055

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