Journal article
Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper
Department of Health Technology, Technical University of Denmark1
Manufacturing Engineering, Department of Mechanical Engineering, Technical University of Denmark2
Technical University of Denmark3
Department of Physics, Technical University of Denmark4
Neutrons and X-rays for Materials Physics, Department of Physics, Technical University of Denmark5
Aarhus University6
University of Victoria BC7
Department of Chemistry, Technical University of Denmark8
Biotherapeutic Engineering and Drug Targeting, Department of Health Technology, Technical University of Denmark9
Biologically Inspired Material Engineering, Biotherapeutic Engineering and Drug Targeting, Department of Health Technology, Technical University of Denmark10
The Danish Polymer Centre, Department of Chemical and Biochemical Engineering, Technical University of Denmark11
Department of Chemical and Biochemical Engineering, Technical University of Denmark12
Bam University of Medical Sciences13
Department of Electrical Engineering, Technical University of Denmark14
Electronics, Department of Electrical Engineering, Technical University of Denmark15
Department of Mechanical Engineering, Technical University of Denmark16
...and 6 moreToday's consumer electronics are made from nonrenewable and toxic components. They are also rigid, bulky, and manufactured in an energy-inefficient manner via CO2-generating routes. Though petroleum-based polymers such as polyethylene terephthalate and polyethylene naphthalate can address the rigidity issue, they have a large carbon footprint and generate harmful waste.
Scalable routes for manufacturing electronics that are both flexible and ecofriendly (Fleco) could address the challenges in the field. Ideally, such substrates must incorporate into electronics without compromising device performance. In this work, we demonstrate that a new type of wood-based [nanocellulose (NC)] material made via nanosilicate (NS) reinforcement can yield flexible electronics that can bend and roll without loss of electrical function.
Specifically, the NSs interact electrostatically with NC to reinforce thermal and mechanical properties. For instance, films containing 34 wt % of NS displayed an increased young's modulus (1.5 times), thermal stability (290 → 310 °C), and a low coefficient of thermal expansion (40 ppm/K). These films can also easily be separated and renewed into new devices through simple and low-energy processes.
Moreover, we used very cheap and environmentally friendly NC from American Value Added Pulping (AVAP) technology, American Process, and therefore, the manufacturing cost of our NS-reinforced NC paper is much cheaper ($0.016 per dm-2) than that of conventional NC-based substrates. Looking forward, the methodology highlighted herein is highly attractive as it can unlock the secrets of Fleco electronics and transform otherwise bulky, rigid, and "difficult-to-process" rigid circuits into more aesthetic and flexible ones while simultaneously bringing relief to an already-overburdened ecosystem.
Language: | English |
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Publisher: | American Chemical Society |
Year: | 2020 |
Pages: | 48027-48039 |
ISSN: | 19448252 and 19448244 |
Types: | Journal article |
DOI: | 10.1021/acsami.0c15326 |
ORCIDs: | 0000-0001-9447-1089 , Mehrali, Mehdi , 0000-0003-1056-4152 , 0000-0002-2025-2171 , 0000-0003-2902-6557 , Kadumudi, Firoz Babu , Zsurzsan, Tiberiu Gabriel , Alehosseini, Morteza , Gundlach, Carsten , Knott, Arnold , Almdal, Kristoffer and Dolatshahi-Pirouz, Alireza |