Journal article
High-pressure silicon sensor with low-cost packaging
In
Sensors and Actuators A-physical
—
2001, Volume 92, Issue 1-3, pp. 16-22
From
Danfoss A/S, CAT, DTU, Building 347, 2800 Lyngby, Denmark1
Danfoss A/S, 6400 Nordborg, Denmark2
Abstract
We present a silicon high-pressure sensor based on fusion bonding with lateral feed-through and a compact low-cost packaging. The sensor has a burst pressure exceeding 3000bar and can be designed for a maximum pressure in the range from 35 to 1500bar and temperatures ranging from −40 to 120°C. Design considerations and test results of the sensor are presented.
| Language: | English |
|---|---|
| Year: | 2001 |
| Pages: | 16-22 |
| ISSN: | 18733069 and 09244247 |
| Types: | Journal article |
| DOI: | 10.1016/S0924-4247(01)00534-9 |
