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Interpreted as:

title:(Multiple AND through-wafer AND interconnects AND with AND advanced AND metallization AND system AND for AND solder AND bonding.)

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1 Conference paper

Multiple through-wafer interconnects with advanced metallization system for solder bonding

Heschel, Matthias; Rasmussen, Kjeld; Kuhmann, Jochen Friedrich; Bouwstra, Siebe

Multiple Through-wafer Interconnects With Advanced Metallization System for Solder Bonding — 1999, pp. 121-24

Year: 1999

Language: English

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2 Conference paper

Multiple through-wafer interconnects with advanced metallization system for solder bonding

Heschel, Matthias; Rasmussen, Kjeld; Tang, Peter Torben; Kuhmann, Jochen Friedrich; Bouwstra, Siebe

Multiple Through-wafer Interconnects With Advanced Metallization System for Solder Bonding — 1999, pp. 1228-31

Year: 1999

Language: English

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