Journal article
DREM2: a facile fabrication strategy for freestanding three dimensional silicon micro- and nanostructures by a modified Bosch etch process
Three dimensional (3D) silicon micro- and nanostructures enable novel functionalities and better device performances in various fields. Fabrication of real 3D structures in a larger scale and wider applications has been proven to be limited by the technical difficulties during the fabrication process, which normally requires multiple process steps and techniques.
Direct top-down fabrication processes by modifying a plasma etch process have been proposed and studied in previous studies. However, the repeatability, size uniformity and the maximal number of stacked layers were limited. Here we report a facile single run fabrication strategy for three dimensional silicon micro- and nanostructures.
A good uniformity of suspended layer thickness has to be achieved and up to 10 stacked layers have been fabricated in a single run without other additional steps or post-process procedures. This is enabled by a modified multiplexed Bosch etch process, so called DREM (deposit, remove, etch, multistep), while the DREM etch is used to transfer the patterns into silicon, an extra isotropic etch creates a complete undercut and thus freestanding structures come into form.
This method is easy to program and provides well-controlled etch profiles.
Language: | English |
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Year: | 2018 |
Pages: | 105012 |
ISSN: | 13616439 and 09601317 |
Types: | Journal article |
DOI: | 10.1088/1361-6439/aad0c4 |
ORCIDs: | Chang, Bingdong , Jensen, Flemming , Hübner, Jörg and Jansen, Henri |