Journal article
Broadband Packaging of Photodetectors for 100 Gb/s Ethernet Applications
The packing structure of functional modules is a major limitaion in achieving a desired performance for 100 Gb/s ethernet applications. This paper presents a methodology of developing advanced packaging of photodetectors (PDs) for high-speed data transmission applications by using 3-D electromagnetic (EM) simulations.
A simplified model of the PD module is first used to analyze and optimize packaging structures and propose an optimal packaging design based on the simplified model. Although a PD module with improved performance proved the success of the optimal packaging design, the simplified model could not identify other important bandwidth limitation effects.
Therefore, a full 3-D EM model of PD modules is developed to predict the optical-to-electrical response of the module, and with this model, it is possible to identify a critical mode mismatch effect as another important factor of limiting the bandwidth of PD modules. After eliminating the mode mismatch effect by improving the chip-conductor-backed coplanar waveguide transition, a final optimal packaging structure is implemented for the PD module with reduced attenuation up to 100 GHz and a broader 3-dB bandwidth of more than 90 GHz.
Furthermore, the PD module exhibits excellent performance under the high-speed data-transmission experiment with 107 Gb/s data rate.
| Language: | English |
|---|---|
| Publisher: | IEEE |
| Year: | 2013 |
| Pages: | 422-429 |
| ISSN: | 21563985 and 21563950 |
| Types: | Journal article |
| DOI: | 10.1109/TCPMT.2012.2236149 |
| ORCIDs: | Johansen, Tom Keinicke |
3-D electromagnetic (EM) modeling 3-dB bandwidth Mode mismatch Packaging Photodetector (PD)
3D EM simulations Attenuation Bandwidth Connectors Ethernet applications Insertion loss PD module Semiconductor device measurement Solid modeling bit rate 100 Gbit/s bit rate 107 Gbit/s chip-conductor-backed coplanar waveguide transition coplanar waveguides electronics packaging high-speed data transmission applications lead bonding local area networks mode mismatch optical-to-electrical response optimal packaging design optimisation optoelectronic devices packaging packaging structure analysis packaging structure optimization photodetector (PD) photodetector broadband packaging photodetectors three-dimensional electromagnetic simulations
