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Journal article

Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

By Sopousek, J.1; Palcut, Marián2,3,4; Hodúlová, Erika5; Janovec, Jozef5

From

Masaryk University1

Electroceramics, Fuel Cells and Solid State Chemistry Division, Risø National Laboratory for Sustainable Energy, Technical University of Denmark2

Fuel Cells and Solid State Chemistry Division, Risø National Laboratory for Sustainable Energy, Technical University of Denmark3

Risø National Laboratory for Sustainable Energy, Technical University of Denmark4

Slovak University of Technology in Bratislava5

The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature.

The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations.

The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.

Language: English
Publisher: Springer US
Year: 2010
Pages: 312-317
ISSN: 1543186x and 03615235
Types: Journal article
DOI: 10.1007/s11664-009-1070-2
Keywords

Brændselsceller og brint Fuel Cells and hydrogen Solid Oxide Fuel Cells

Other keywords

CALPHAD Characterization and Evaluation of Materials DSC simulation Electronics and Microelectronics, Instrumentation Lead-free soldering Material Science Optical and Electronic Materials Solid State Physics solidification

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