Journal article · Ahead of Print article
Tunable MEMS VCSEL on Silicon Substrate
Department of Photonics Engineering, Technical University of Denmark1
National Centre for Nano Fabrication and Characterization, Technical University of Denmark2
Surface Physics and Catalysis, Department of Physics, Technical University of Denmark3
Quantum and Laser Photonics, Department of Photonics Engineering, Technical University of Denmark4
Ultra-fast Optical Communication, Department of Photonics Engineering, Technical University of Denmark5
Nanophotonic Devices, Department of Photonics Engineering, Technical University of Denmark6
OCTLIGHT ApS7
Alight Technologies ApS8
St. Petersburg Academic University9
Nanofabrication, National Centre for Nano Fabrication and Characterization, Technical University of Denmark10
Silicon Microtechnology, Nanofabrication, National Centre for Nano Fabrication and Characterization, Technical University of Denmark11
...and 1 moreWe present the design, fabrication, and characterization of a MEMS VCSEL which utilized a silicon on insulator wafer for the microelectromechanical system and encapsulates the MEMS by direct InP wafer bonding in order to improve the protection and control of the tuning element. This can enable more robust fabrication, a larger free spectral range, and bidirectional tuning of the MEMS element.
The proposed device uses a high contrast grating mirror on a MEMS stage as the bottom mirror, wafer bondind InP with quantum wells for amplification and a deposited dielectric DBR. A tuning range of 40 nm and a mechanical resonance frequency of >2 MHz is demonstrated. We present design, fabrication, and characterization of an optically pumped MEMS VCSEL which utilizes a silicon-on-insulator wafer for the microelectromechanical system and encapsulates the MEMS by direct InP wafer bonding, which improves the protection and control of the tuning element.
This procedure enables a more robust fabrication, a larger free spectral range, and facilitates bidirectional tuning of the MEMS element. The MEMS VCSEL device uses a high contrast grating mirror on a MEMS stage as the bottom mirror, a wafer-bonded InP with quantum wells for amplification and a deposited dielectric DBR as the top mirror.
A 40-nm tuning range and a mechanical resonance frequency in excess of 2 MHz are demonstrated.
| Language: | English |
|---|---|
| Publisher: | IEEE |
| Year: | 2019 |
| Pages: | 1-7 |
| ISSN: | 15584542 and 1077260x |
| Types: | Journal article and Ahead of Print article |
| DOI: | 10.1109/JSTQE.2019.2927575 |
| ORCIDs: | Sahoo, Hitesh Kumar , Semenova, Elizaveta , Hansen, Ole and Yvind, Kresten |
Integration MEMS OCT Silicon Swept source VCSEL Wavelength tunable
Cavity resonators III-V semiconductors InP Indium phosphide Micromechanical devices Mirrors Si Substrates Vertical cavity surface emitting lasers bidirectional tuning deposited dielectric DBR diffraction gratings direct InP wafer bonding distributed Bragg reflector lasers free spectral range high contrast grating mirror indium compounds integration laser laser mirrors laser tuning mechanical resonance frequency microelectromechanical system micromirrors optical design techniques optical fabrication optical pumping optical testing quantum wells silicon silicon-on-insulator silicon-on-insulator wafer surface emitting lasers swept source tunable MEMS VCSEL on silicon substrate wafer bonding wavelength 40.0 nm wavelength tunable
