Journal article
Comparison of Ultrasonic Welding and Thermal Bonding for the Integration of Thin Film Metal Electrodes in Injection Molded Polymeric Lab-on-Chip Systems for Electrochemistry
Department of Micro- and Nanotechnology, Technical University of Denmark1
Nanoprobes, Department of Micro- and Nanotechnology, Technical University of Denmark2
Bioanalytics, Department of Micro- and Nanotechnology, Technical University of Denmark3
Polymer Micro & Nano Engineering, Department of Micro- and Nanotechnology, Technical University of Denmark4
We compare ultrasonic welding (UW) and thermal bonding (TB) for the integration of embedded thin-film gold electrodes for electrochemical applications in injection molded (IM) microfluidic chips. The UW bonded chips showed a significantly superior electrochemical performance compared to the ones obtained using TB.
Parameters such as metal thickness of electrodes, depth of electrode embedding, delivered power, and height of energy directors (for UW), as well as pressure and temperature (for TB), were systematically studied to evaluate the two bonding methods and requirements for optimal electrochemical performance.
The presented technology is intended for easy and effective integration of polymeric Lab-on-Chip systems to encourage their use in research, commercialization and education.
| Language: | English |
|---|---|
| Publisher: | MDPI |
| Year: | 2016 |
| Pages: | 1795 |
| ISSN: | 14243210 and 14248220 |
| Types: | Journal article |
| DOI: | 10.3390/s16111795 |
| ORCIDs: | Taboryski, Rafael J. , Heiskanen, Arto , Zor, Kinga and Emnéus, Jenny |
