Microstructure stability of silver electrodeposits at room temperature

In situ quantitative X-ray diffraction analysis was used to investigate the kinetics of microstructure evolution at room temperature (self-annealing) in an electrodeposited silver layer. As a function of time at room temperature the as-deposited nanocrystalline microstructure evolved considerably: orientation-dependent grain growth and changes of the preferred grain orientation occurred.

It is demonstrated for the first time that self-annealing occurs for electrodeposited silver layers and, hence, is not a unique feature of copper as often suggested.