Journal article
Effect of Solder Mask Surface Chemistry and Morphology on the Water Layer Formation Under Humid Conditions
This paper investigates the water film buildup on solder masked printed circuit board assembly (PCBA) laminates under humid conditions. The effects of solder mask surface chemistry, morphology, and roughness were investigated using different commercial laminates coated with solder mask. Chemical composition of the materials was analyzed using Fourier transform infrared spectroscopy.
Microstructure and surface morphology were investigated using scanning electron microscopy, whereas the wettability was assessed using static contact angle technique, and correlated with the morphological observations. Solder mask surface waviness was characterized and quantified using a mechanical stylus profilometer.
The formation of water film on a PCBA surface was monitored in situ by optical microscopy and electrochemical impedance spectroscopy and correlated with the observations of surface features. The results show that the solder mask surface chemistry and morphology significantly influence the water film formation, which is important for corrosion reliability of electronics exposed to humid conditions.
| Language: | English |
|---|---|
| Publisher: | IEEE |
| Year: | 2018 |
| Pages: | 1756-1768 |
| ISSN: | 21563985 and 21563950 |
| Types: | Journal article |
| DOI: | 10.1109/TCPMT.2018.2792047 |
| ORCIDs: | Din, Rameez Ud , Jellesen, Morten Stendahl and Ambat, Rajan |
Corrosion Electronics reliability Humidity Printed circuit board assembly (PCBA) manufacturing Solder mask
Fourier transform infrared spectroscopy Fourier transform spectra Morphology PCBA surface Rough surfaces Surface impedance Surface morphology Surface roughness Surface treatment assembling chemical composition contact angle corrosion reliability electrochemical impedance spectroscopy electronics reliability humid conditions humidity infrared spectra laminates masks mechanical stylus profilometer optical microscopy printed circuit board assembly (PCBA) manufacturing printed circuits scanning electron microscopy solder mask solder mask surface chemistry solder mask surface waviness solder masked PCBA laminates solder masked printed circuit board assembly laminates soldering solders static contact angle technique surface chemistry surface contamination surface morphology surface roughness water film buildup water film formation water layer formation wettability wetting
