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Journal article

Review of electrical characterization of ultra-shallow junctions with micro four-point probes

From

Nanointegration Group, NanoSystemsEngineering Section, Department of Micro- and Nanotechnology, Technical University of Denmark1

NanoSystemsEngineering Section, Department of Micro- and Nanotechnology, Technical University of Denmark2

Department of Micro- and Nanotechnology, Technical University of Denmark3

Silicon Microtechnology Group, MicroElectroMechanical Systems Section, Department of Micro- and Nanotechnology, Technical University of Denmark4

MicroElectroMechanical Systems Section, Department of Micro- and Nanotechnology, Technical University of Denmark5

Center for Nanoteknologi, Centers, Technical University of Denmark6

Center for Individual Nanoparticle Functionality, Centers, Technical University of Denmark7

Electrical characterization of ultra-shallow junctions, relying on advanced implant and anneal processes, has received much attention in the past few years since conventional characterization methods fail. With continued scaling of semiconductor devices, the problems associated with conventional techniques will become even more evident.

In several recent studies micro four-point probe (M4PP) has been demonstrated as a reliable high precision metrology method for both sheet resistance and Hall effect measurements of ultra-shallow implants and has revealed a promising potential for carrier profiling.

Language: English
Publisher: American Vacuum Society
Year: 2010
Pages: 27-33
ISSN: 21662754 , 21662746 and 10711023
Types: Journal article
DOI: 10.1116/1.3224898
ORCIDs: Petersen, Dirch Hjorth , Hansen, Ole and Bøggild, Peter
Keywords

1-D Metrology

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