Journal article · Ahead of Print article
Two level undercut-profile substrate-based filamentary coated conductors produced using metal organic chemical vapor deposition
Department of Energy Conversion and Storage, Technical University of Denmark1
Electrofunctional materials, Department of Energy Conversion and Storage, Technical University of Denmark2
SuperPower Inc.3
Karlsruhe Institute of Technology4
Department of Wind Energy, Technical University of Denmark5
Wind Turbine Structures and Component Design, Department of Wind Energy, Technical University of Denmark6
Office for Innovation & Sector Services, Administration, Technical University of Denmark7
Technical University of Denmark8
The two level undercut-profile substrate (2LUPS) has been introduced as a concept for subdividing rare-earth-Ba$_{2}$Cu$_{3}$O$_{7}$ (REBCO) coated conductors (CC) into narrow filaments which reduces the AC losses and improves field stability for DC magnets. The 2LUPS consists of two levels of plateaus connected by a wall with an undercut-profile, which enables a physical separation of the superconducting layer between the plateaus without reducing the effective width of the superconducting layer.
In this study we report for the first time the results of fabrication and characterization of a filamentary CC produced in an industrial setup by SuperPower Inc. using ion beam assisted deposition and metal organic chemical vapor deposition (IBAD-MOCVD) on a 2LUPS substrate realized at the Technical University of Denmark (DTU), whereas previous studies discussed the fabrication using alternating beam assisted deposition and pulsed laser deposition (ABAD-PLD).
We also present Hall probe scanning measurements performed using a standard TAPESTAR® XL machine that is routinely employed for industrial critical current characterization of long length CCs. It clear that additional analysis of the measured field profiles are required when characterizing filamentary 2LUPS CC using a standard TAPESTAR® setting.
Using FEM we calculated the expected magnetization response and we find a good agreement.
Language: | English |
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Publisher: | IEEE |
Year: | 2018 |
Pages: | 1-1 |
ISSN: | 15582515 , 10518223 and 23787074 |
Types: | Journal article and Ahead of Print article |
DOI: | 10.1109/TASC.2018.2808365 |
ORCIDs: | Insinga, Andrea R. , Abrahamsen, Asger Bech Bech , Grivel, Jean-Claude and Wulff, Anders Christian |