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Conference paper · Journal article

Modelling the deformation of nickel foil during manufacturing of nanostructures on injection moulding tool inserts

From

Department of Mechanical Engineering, Technical University of Denmark1

Manufacturing Engineering, Department of Mechanical Engineering, Technical University of Denmark2

Polymer Micro & Nano Engineering, Department of Micro- and Nanotechnology, Technical University of Denmark3

Department of Micro- and Nanotechnology, Technical University of Denmark4

InMold Biosystems A/S5

DFM - Dansk Fundamental Metrologi A/S6

Nanyang Technological University7

In the present work, a manufacturing process for transferring nanostructures from a glass wafer, to a double-curvedinsert for injection moulding is demonstrated. A nanostructure consisting of sinusoidal cross-gratings with a period of 426 nm issuccessfully transferred to hemispheres on an aluminium substrate with three different radii; 500 μm, 1000 μm and 2000 μm,respectively.

The nanoimprint is performed using a 50 μm thick nickel foil, manufactured using electroforming. During theimprinting process, the nickel foil is stretched due to the curved surface of the aluminium substrate. Experimentally, it is possibleto address this stretch by counting the periods of the cross-gratings via SEM characterization.

A model for the deformation of thenickel foil during nanoimprint is developed, utilizing non-linear material and geometrical behaviour. Good agreement betweenmeasured and numerically calculated stretch ratios on the surface of the deformed nickel foil is found, and it is shown, that fromthe model it is also possible to predict the geometrical extend of the nanostructured area on the curved surfaces.

Language: English
Publisher: AIP Publishing LLC
Year: 2016
Proceedings: The 19th International ESAFORM Conference on Material Forming (ESAFORM 2016)
ISSN: 15517616 and 0094243x
Types: Conference paper and Journal article
DOI: 10.1063/1.4963493
ORCIDs: Sonne, Mads Rostgaard , Hattel, Jesper Henri and Taboryski, Rafael J.

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