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Journal article

Contact of ZnSb thermoelectric material to metallic electrodes using S-Bond 400 solder alloy

By Abbas Malik, Safdar1; Thanh Hung, Le1; Van Nong, Ngo1

From

Department of Energy Conversion and Storage, Technical University of Denmark, Risø Campus, 4000 Roskilde, Denmark1

Language: English
Year: 2019
Pages: 625-631
ISSN: 22147853
Types: Journal article
DOI: 10.1016/j.matpr.2019.02.062
Keywords

Interface Kinetics S-Bond 400 Thermoelectric Modules Zinc Antimonide

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