Journal article
Novel SU-8 based vacuum wafer-level packaging for MEMS devices
Department of Micro- and Nanotechnology, Technical University of Denmark1
Dynamic NEMS Group, NanoSystemsEngineering Section, Department of Micro- and Nanotechnology, Technical University of Denmark2
NanoSystemsEngineering Section, Department of Micro- and Nanotechnology, Technical University of Denmark3
Nanoprobes Group, NanoSystemsEngineering Section, Department of Micro- and Nanotechnology, Technical University of Denmark4
This work presents a simple and low-cost SU-8 based wafer-level vacuum packaging method which is CMOS and MEMS compatible. Different approaches have been investigated by taking advantage of the properties of SU-8, such as chemical resistance, optical transparence, mechanical reliability and versatility.
A novel technique of wafer level adhesive bonding, which uses SU-8 as structural and adhesive material, has been developed and successfully demonstrated. Optical inspection and SEM images were used in order to measure the package lid bending and probe the encapsulation sealing. In addition, an indirect vacuum level measurement has been carried out by comparing the different quality factors of a test cantilever resonator when this element is packed or unpacked.
Language: | English |
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Year: | 2010 |
Pages: | 1173-1176 |
ISSN: | 18735568 and 01679317 |
Types: | Journal article |
DOI: | 10.1016/j.mee.2009.12.048 |
ORCIDs: | Keller, Stephan Urs and Boisen, Anja |