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Conference paper

Black Silicon realized by reactive ion etching (ICP) without platen power

In 2018 Ieee 7th World Conference on Photovoltaic Energy Conversion (wcpec) (a Joint Conference of 45th Ieee Pvsc, 28th Pvsec & 34th Eu Pvsec) — 2018, pp. 0041-0044
From

Department of Micro- and Nanotechnology, Technical University of Denmark1

Silicon Microtechnology, Department of Micro- and Nanotechnology, Technical University of Denmark2

Technical University of Denmark3

Reflectance and minority carrier lifetime were measured for black silicon textured by different inductively coupled plasma (ICP) reactive ion etching processes without any capacitively coupled power (platen power). Reflectance was reduced to below 5% after 2 minutes and below 4% after 3 minutes etch time, with several accessible routes to lower reflectance identified.

Black silicon wafers were passivated by atomic-layer deposited (ALD) Al2O3 and minority carrier lifetime was measured to 2.1 ms for 2 minutes texturing, while minority carrier lifetimes were well below 1.0 ms for etch times in the 5-20 min range. Samples measured immediately after ALD activation, show minority carrier lifetime above 3 ms for RIE process time between 1.5 and 3 min and between 2.5 and 3 ms for etching times above 3 min.

These results indicate that ultra-low reflectance and minority carrier lifetime on par with those of the best passivated solar cells to date may be achieved after texturing for just 2 min.

Language: English
Publisher: IEEE
Year: 2018
Pages: 0041-0044
Proceedings: 7th World Conference on Photovoltaic Energy Conversion
ISBN: 1538685299 , 1538685302 , 9781538685297 and 9781538685303
Types: Conference paper
DOI: 10.1109/PVSC.2018.8548283
ORCIDs: Davidsen, Rasmus Schmidt , Iandolo, Beniamino and Hansen, Ole

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