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Interpreted as:

title:(Thermal AND Modeling AND Based AND on AND SPICE AND Simulation)

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1 Conference paper

Thermal Modeling Based on SPICE Simulation

Liu, Wei; Calimera, Andrea; Nannarelli, Alberto; Macii, Enrico; Poncino, Massimo

Proc. of 19th International Workshop on Power and Timing Modeling, Optimization and Simulation (patmos) — 2009

Year: 2009

Language: English

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2 Conference paper

On-chip Thermal Modeling Based on SPICE Simulation

Liu, Wei; Calimera, Andrea; Nannarelli, Alberto; Macii, Enrico; Poncino, Massimo

Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation — 2010, pp. 66-75

circuit reliability. A SPICE simulation based thermal modeling method is proposed in this paper. Experiments on a set of tests show the correlations between functional and spatial hotspots in a circuit implemented in STM 65nm technologies.

Year: 2010

Language: English

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