Conference paper
Microprobe metrology for direct sheet resistance and mobility characterization
Technical University of Denmark1
Department of Micro- and Nanotechnology, Technical University of Denmark2
Nanointegration, Department of Micro- and Nanotechnology, Technical University of Denmark3
Silicon Microtechnology, Department of Micro- and Nanotechnology, Technical University of Denmark4
Surface Physics and Catalysis, Department of Physics, Technical University of Denmark5
Center for Individual Nanoparticle Functionality, Centers, Technical University of Denmark6
The M4PP measurement technique has gained increased interest from the semiconductor industry for direct sheet resistance measurements on ultra thin layers and small structures/pads. Several fully automatic microRSP probing tools are today in use for in-line sheet resistance measurements on blanket and patterned wafers.
Using the next generation of microRSP probing tools it will be possible to perform both sheet resistance, mobility and active carrier density measurements using the collinear M4PP. In this article we demonstrate the various techniques necessary to perform high quality measurements using the M4PP and present the technical progress made during the last few years.
| Language: | English |
|---|---|
| Year: | 2012 |
| Pages: | 100-105 |
| Proceedings: | 12th International Workshop on Junction Technology |
| ISBN: | 1467312568 , 1467312576 , 1467312584 , 9781467312561 , 9781467312578 and 9781467312585 |
| Types: | Conference paper |
| DOI: | 10.1109/IWJT.2012.6212819 |
| ORCIDs: | Petersen, Dirch Hjorth and Hansen, Ole |
M4PP measurement technique active carrier density measurement automatic microRSP probing tool direct sheet resistance measurement electric resistance measurement in-line sheet resistance measurement microprobe metrology mobility characterization patterned wafers semiconductor industry small structures/pads ultra thin layers
