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Conference paper

Fast, versatile, and non-destructive biscuit inspection system using spectral imaging

In Proceedings of 2017 Fifteenth Iapr International Conference on Machine Vision Applications — 2017, pp. 502-505

By Carstensen, Jens Michael1,2

From

Department of Applied Mathematics and Computer Science, Technical University of Denmark1

Visual Computing, Department of Applied Mathematics and Computer Science, Technical University of Denmark2

A fast, versatile, and non-destructive method for assessing biscuit quality is presented. The method integrates color (or browning) measurement, moisture assessment, compositional and dimensional measurements on a spectral imaging platform using the silicon range 400–1000 nm.

Language: English
Publisher: IEEE
Year: 2017
Pages: 502-505
Proceedings: Fifteenth IAPR International Conference on Machine Vision Applications
ISBN: 1538604957 , 4901122169 , 9781538604953 and 9784901122160
Types: Conference paper
DOI: 10.23919/MVA.2017.7986910
ORCIDs: Carstensen, Jens Michael
Keywords

Image color analysis Imaging Indexes Moisture Moisture measurement Reflectivity Training biscuit inspection system biscuit quality assessment color measurement compositional measurement dimensional measurement fast method food products image colour analysis inspection moisture moisture assessment nondestructive method product quality production engineering computing spectral analysis spectral imaging versatile method

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