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Conference paper

Activation of ion implanted Si for backside processing by Ultra-fast Laser Thermal Annealing: Energy homogeneity and micro-scale sheet resistance

From

Department of Micro- and Nanotechnology, Technical University of Denmark1

Nanointegration Group, NanoSystemsEngineering Section, Department of Micro- and Nanotechnology, Technical University of Denmark2

NanoSystemsEngineering Section, Department of Micro- and Nanotechnology, Technical University of Denmark3

Silicon Microtechnology Group, MicroElectroMechanical Systems Section, Department of Micro- and Nanotechnology, Technical University of Denmark4

MicroElectroMechanical Systems Section, Department of Micro- and Nanotechnology, Technical University of Denmark5

Center for Individual Nanoparticle Functionality, Centers, Technical University of Denmark6

Center for Nanoteknologi, Centers, Technical University of Denmark7

In this paper ion activation of implanted silicon using ultra-fast laser thermal annealing (LTA) process was discussed. The results stated that there was high dopant activation using LTA process for over 70%, excellent within shot activation uniformity, and there was a possibility for overlap parameter optimization.

It was observed that, for activation LTA process, shallow box-shaped profiles- high diffusivity of B in liquids and high-temperatures was observed only near the surface in a submicrosecond timescale. Possible solutions were suggested as to low-cost and high-end for overlap optimization and full-die exposure optics.

Language: English
Publisher: IEEE
Year: 2009
Pages: 1-19
Proceedings: 17th International Conference on Advanced Thermal Processing of Semiconductors RTP09
ISBN: 1424438144 , 1424438152 , 9781424438143 and 9781424438150
ISSN: 1944026x and 19440251
Types: Conference paper
DOI: 10.1109/RTP.2009.5373465
ORCIDs: Petersen, Dirch Hjorth and Hansen, Ole

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