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Conference paper

On-chip patch antenna on InP substrate for short-range wireless communication at 140 GHz

In Proceedings of Microwave and Optoelectronics Conference (imoc), 2017 Sbmo/ieee Mtt-s International — 2017, pp. 1-5
From

Department of Electrical Engineering, Technical University of Denmark1

Electromagnetic Systems, Department of Electrical Engineering, Technical University of Denmark2

Center for Magnetic Resonance, Department of Electrical Engineering, Technical University of Denmark3

This paper presents the design of an on-chip patch antenna on indium phosphide (InP) substrate for short-range wireless communication at 140 GHz. The antenna shows a simulated gain of 5.3 dBi with 23% bandwidth at 140 GHz and it can be used for either direct chip-to-chip communication or chip-level integration and packaging.

In the transmission frequency band from 130 GHz to 150 GHz the estimated in-band gain variation is 0.5 dBi which guarantees gain uniformity. The antenna with optimized dimension is implemented for a transition between elevated coplanar waveguide (ECPW) and rectangular waveguide. The chip-to-waveguide transition in back-to-back configuration exhibits a simulated return loss of 10 dB and insertion loss of 3 dB from 128 GHz to 153 GHz.

For higher directivity, a horn antenna is used together with the chip-to-waveguide transition forming an extended packaging structure that is suitable for the transceiver (Tx and Rx) chips. The simulated gain of the extended packaging structure is 11.9 dBi with 23% bandwidth at 140 GHz and the in-band gain variation is 2 dBi.

Language: English
Publisher: IEEE
Year: 2017
Pages: 1-5
Proceedings: 2017 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference
ISBN: 1509062408 , 1509062416 , 1509062424 , 9781509062409 , 9781509062416 and 9781509062423
Types: Conference paper
DOI: 10.1109/IMOC.2017.8121032
ORCIDs: Dong, Yunfeng , Johansen, Tom Keinicke and Zhurbenko, Vitaliy

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