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10 items by relevance
1 Conference paper

Packaging

Fischer, Knud; Larsen, Erling

Consensus Sustainable Aquaculture in Europe. Defining Indicators for Sustainable Aquaculture Development in Europe. a Multi-stakeholder Workshop Held in Oostende, Belgium November 21-23, 2005 — 2006

Year: 2006

Language: English

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2 Journal article

The Packaging Index (PIX) - a proposed methodology for packaging assessment and comparison

Scagnetti, Carla; Lorenz, Manuel; Keller, Jonas; Albrecht, Stefan

E3s Web of Conferences — 2022, Volume 349, pp. 01002

The use of packaging and the related environmental consequences are increasingly under discussion. Despite its advantages, packaging has become the focus of public concern, mainly due to insufficient or inadequate handling of packaging waste. There is plenty of research regarding the sustainability

Year: 2022

Language: Undetermined

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3 Book chapter

Introduction into Photonic Packaging

Fischer-Hirchert, Ulrich H. P.

Photonic Packaging Sourcebook — 2015, pp. 1-21

communications systems will be discussed. Further, many examples of photonic packagingPhotonic packaging and interconnection technology are presented in depth. All actual adjustment and fixation techniquesFixation techniques are focused. A deeper analysis of the optical interconnection technology with basic

Year: 2015

Language: English

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4 Book chapter

15 - Beer packaging

Hofmann, R.; Fischer, J.

Brewing Microbiology — 2015, pp. 319-334

Beer packaging and, in particular, beer filling may be considered as the process with the highest risk potential for so-called secondary contaminations of the product. This chapter gives an overview on the microbiological hazards that may be present in the filling hall. Certain popular filling

Year: 2015

Language: English

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5 Journal article

Method for Strategic Design in the Food Packaging System: Packaged Product Life Cycle Tool

Huerta, Oscar; Melo, Carolina; Rubio, Maximiliano; Tiska, Amelia

E3s Web of Conferences — 2022, Volume 349, pp. 01007

A research study was conducted in order to understand how food packaging systems are configured in Chile, and what should a method for strategic design within food packaging systems address. Relevant literature about these topics was consulted and analyzed. A series of interviews were conducted

Year: 2022

Language: Undetermined

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6 Journal article

A Methodology for Determining the Proper Point Size for Display Type on Packaging by Means of the Package's Proportions : DETERMINING DISPLAY TYPE ON PACKAGING BY MEANS OF PROPORTIONS

Hurley, Rupert Andrew; Fischer, Joanna; Ouzts, Andrew D.; Leininger, John; Thomas, Ronald

Packaging Technology and Science — 2014, Volume 27, Issue 12, pp. 921-931

Year: 2014

Language: English

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7 Journal article

The MCHF atomic-structure package

Fischer, Charlotte Froese

Computer Physics Communications — 1999, Volume 128, Issue 3, pp. 635-636

The programs, as described in Computational Atomic Structure: An MCHF Approach (C. Froese Fischer, T. Brage, and P. Jönsson, Institute of Physics (Bristol, 1997)) are collected into an atomic structure package. Included with the package are test examples with complete output of results. Also

Year: 1999

Language: English

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8 Dataset

The MCHF atomic-structure package

Fischer, Charlotte Froese

Abstract The programs, as described in Computational Atomic Structure: An MCHF Approach (C. Froese Fischer, T. Brage, and P. Jönsson, Institute of Physics (Bristol, 1997)) are collected into an atomic structure package. Included with the package are test examples with complete output of results

Year: 2019

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9 Conference paper

Antennas in package with stacked metallization

Hamidipour, Abouzar; Fischer, Alexander; Maurer, Linus; Hartner, Walter; Stelzer, Andreas

2013 European Microwave Conference — 2013, pp. 56-59

This paper proposes a stacked metallization technique to improve the performance of millimeter-wave antennas in packages in terms of antenna gain and the behavior of the beam pattern. A rhombic antenna and a 77-GHz SiGe transceiver were integrated in a 6×6mm2 embedded wafer level ball grid array package. The surface of the package was stacked with a metallic layer except for a defined area above the antenna. The area is designed to have an unidirectional electromagnetic field distributions and acts as a secondary aperture antenna. The effective isotropic radiated power of the ant...

Year: 2013

Language: English

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10 Conference paper

A 77-GHz antenna in package

Fischer, A.; Ziqiang Tong; Hamidipour, A.; Maurer, L.; Stelzer, A.

2011 41st European Microwave Conference — 2011, pp. 1316-1319

A novel 77-GHz directional folded dipole antenna integrated in an embedded wafer level ball grid array (eWLB) package is presented. For the characterization of the antenna a frequency multiplier is embedded, which scales the 4.25-GHz input signal up to 76.5 GHz and allows the use of a commercial

Year: 2011

Language: English

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