Homogeneity analysis of high yield manufacturing process of mems-based pzt thick film vibrational energy harvesters

This work presents a high yield wafer scale fabrication of MEMS-based unimorph silicon/PZT thick film vibrational energy harvesters aimed towards vibration sources with peak frequencies in the range of a few hundred Hz. By combining KOH etching with mechanical front side protection, SOI wafer to accurately define the thickness of the silicon part of the harvester and a silicon compatible PZT thick film screen-printing technique, we are able to fabricate energy harvesters on wafer scale with a yield higher than 90%.

The characterization of the fabricated harvesters is focused towards the full wafer/mass-production aspect; hence the analysis of uniformity in harvested power and resonant frequency.