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title:(Molecular AND dynamics AND simulation AND of AND the AND thermal AND transport AND on AND holey AND copper AND substrates)

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1 Conference paper

Molecular Dynamics Simulation of the Thermal Transport on Holey Copper Substrates

on solid-liquid heat transfer using molecular dynamics simulations in the presence of nanoscale surface structures - here represented by nanoholes in the surface. As a result,the larger hole can enable a better capacity to water molecules for absorbing the energy from copper substrate. Therefore, the presence

Year: 2019

Language: English

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2 Conference paper

Molecular dynamics simulation of the thermal transport on holey copper substrates

dynamics simulations of a water film in contact with a copper substrate with nanoscale surface structures–here represented by nanoholes. Our results indicate that the presence of a nanohole with diameter of 20 Å increases significantly the transfer of thermal energy from the copper substrate to the water

Year: 2019

Language: English

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