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Conference paper

A new type of white LED light source by bonding fluorescent SiC and a near-UV LED

By Ou, Haiyan1,2; Lin, Li1,2

From

Diode Lasers and LED Systems, Department of Photonics Engineering, Technical University of Denmark1

Department of Photonics Engineering, Technical University of Denmark2

Fluorescent silicon carbide (f-SiC) has advantages over phosphors in terms of abundancy, long lifespan, good thermal conductivity and high color rendering index [1, 2]. In this paper, we demonstrate a prototype of fluorescent SiC hybridly integrated with a near UV LED. The fabrication and characterization of the prototype are introduced and the future perspectives are foreseen.

The bonding process of an NUV LED and a B-N co-doped f-SiC epi-layer is shown in Fig.1. HSQ layers are spun on both the 4H-SiC substrate of the NUV LED and the polished backside of the free-standing f-SiC epi-layer. Afterwards, the NUV LED and the f-SiC epi-layer are placed with the surfaces covered by the HSQ layers in contact.

During bonding at 400 °C, HSQ is converted into solid SiOx and by doing so the two samples are bonded together.

Language: English
Year: 2018
Proceedings: 6<sup>th</sup> international workshop on wide bandgap Semiconductor materials and devices
Types: Conference paper
ORCIDs: Ou, Haiyan

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